SL2ICS2001DWの購入情報と機能
| この部品の機能は「I-CODE SLI Label IC bumped wafer specification on UV-tape」です。 |
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製品の詳細 ( データシート PDF )
| 部品番号 | 部品情報 | メーカー | PDF / カテゴリー |
|---|---|---|---|
| SL2ICS2001DW Data | I-CODE SLI Label IC bumped wafer specification on UV-tape SL2ICS2001DW, V1D
I-CODE SLI Label IC bumped wafer specification on UV-tape
Rev. 3.0 5 February 2008
150030
Product data sheet addendum
PUBLIC
1. General description
This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I- |
NXP Semiconductors |
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| SL222R515 | SL222R515 Data Sheet
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Mechanical Specifications (mm)
D: T: Lead Diameter S: L: Coating Lead Run Down (straight Leads) C: 22.0
±
max
6.0 ± max 1.0 ± nom 7.8 38.0 5.0
± ± ±
nom nom max nom nom
B: 11.50 3.65
± ±
Electrical Specifications
Resistance: |
 Ametherm |
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| SL28B | Surface Mount Schottky Rectifier SL22B thru SL210B
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FEATURES
Ideal for automated placement Low forward voltage drop Low leakage current Meets environmental standard MIL-S-19500D Moisture sensitivity:level 1, per J-STD-020 Solder dip 275 °C, 10s Co |
GOOD-ARK |
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